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MCF54455CVP200
NXP
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1 | Coldfire V4 MCF5445x Microcontroller IC 32-Bit Single-Core 200MHz ROMless 360-BGA (23x23) | BGA | MCF54455CVP200 |
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MC68008L8
Motorola
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1 | Microprocessor, 32 Bit, 48 Pin, Ceramic, DIP | Ceramic Dual-In-Line Packages | MC68008L8 |
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Z8038220ASC
LITTELFUSE
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1 | Microprocessors - MPU 20 MHZ 16 BIT Z80 EMBEDDED PROC | Quad Flat Packages | Z8038220ASC |
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AT91SAM9N12-CUR
Microchip
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1 | Microprocessors - MPU BGA GREEN,IND TEMP,MRL A | BGA | AT91SAM9N12-CUR |
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ATSAMA5D42A-CU
Microchip
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1 | Microprocessors - MPU ARM Cortex-A5 MPU 32 bits, 528Mhz | BGA | ATSAMA5D42A-CU |
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ATSAMA5D21C-CU
Microchip
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1 | MICROCHIP - ATSAMA5D21C-CU - MPU, ARM CORTEX-A5, 500MHZ, TFBGA-169 | BGA | ATSAMA5D21C-CU |
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MPC8343CVRADDB
NXP
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1 | PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 266MHz 620-HBGA (29x29) | BGA | MPC8343CVRADDB |
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MC68008FN12F
Motorola
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1 | Microprocessor | Plastic Leaded Chip Carrier | MC68008FN12F |
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AM3357ZCZD27
Texas Instruments
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1 | IC MPU SITARA 275MHZ 324NFBGA | BGA | AM3357ZCZD27 |
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HD6417751RX240V
Renesas Electronics
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1 | The SH7751R is a 32-bit RISC (reduced instruction set computer) microprocessor, featuring a built-in PCI bus controller compatible with PCs and multimedia devices. & It includes the SH-4 CPU, which at the object code level is upwardly compatible with the SH-1, SH-2, and SH-3 microcomputers. The SH7751R has an instruction cache, an operand cache that can be switched between copy-back and write-through modes, a 4-entry full associative instruction TLB (table look aside buffer), and MMU (memory management unit | Quad Flat Packages | HD6417751RX240V |
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STM32MP233DAL3
STMicroelectronics
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1 | Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU, AI, 3D GPU, video decoder, TFT/DSI/LVDS, USB 2.0 | BGA | STM32MP233DAL3 |
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STM32MP157FAA1T
STMicroelectronics
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1 | MPU with Arm Dual Cortex-A7 800 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography | BGA | STM32MP157FAA1T |
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MCF5470VR200
NXP
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1 | Not Recommended for New Designs - MCF547X V4ECORE MMU, FPUPackage:BGA388, plastic ball grid array package; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm bodyProduct:The MCF547x microprocessors are based on the ColdFire® V4 core and feature multiple connectivity peripherals including two Ethernet, peripheral component interconnect (PCI) and other serial interfaces. Addicionally, it offers an encryption accelerator for secure communications in network connected control applications. The MCF54 | BGA | MCF5470VR200 |
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R9A08G045S13GBG#AC0
Renesas Electronics
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1 | The RZ/G3S microprocessor includes a Cortex®-A55 (1.1GHz) CPU, 16-bit LPDDR4 or DDR4 interface and low-power mode. It also has many interfaces such as PCIe, CAN FD, and 12-bit ADC, making it ideal for applications such as IoT edge applications.As a software platform for this product, Renesas provides the Verified Linux package, which includes the Linux Kernel, middleware drivers, and basic software for this product. The Verified Linux package is verified and provided by Renesas. | BGA | R9A08G045S13GBG#AC0 |
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R9A07G044C26GBG#BC0
Renesas Electronics
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1 | The RZ/G2LC microprocessor includes a Cortex®-A55 (1.2 GHz) CPU, 16-bit DDR3L/DDR4 interface, and 3D graphics engine with Arm Mali-G31. It also has many interfaces such as camera input, display output, USB 2.0, and Gbit-Ether, making it ideal for applications such as entry-class industrial human-machine interfaces (HMIs) and embedded devices with GUI capabilities.As a software platform for this product, Renesas provides the Verified Linux Package, which includes the Linux Kernel, middleware drivers, and bas | BGA | R9A07G044C26GBG#BC0 |
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STM32MP235CAL3
STMicroelectronics
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1 | MPU with Dual Arm Cortex-A35 @ 1.2GHz, Cortex-M33 @ 400MHz, 2xEthernet, 2xFD-CAN, LVDS/DSI, H.264 dec, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA | BGA | STM32MP235CAL3 |
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R9A07G075M05GFA#AA0
Renesas Electronics
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1 | RZ/T2M is an industry-leading high-performance multi-function MPU that realizes high-speed processing, high precision control, and functional safety required for industrial equipment such as AC servos and industrial motors. Powered by dual Arm® Cortex®-R52 cores with a maximum frequency of 800MHz for real-time control and embedded with a large tightly coupled memory (576KB) directly connected to the CPU to realize high-performance real-time processing, RZ/T2M enables low latency access by arranging the peri | Quad Flat Packages | R9A07G075M05GFA#AA0 |
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STM32MP157FAA1
STMicroelectronics
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1 | Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto | BGA | STM32MP157FAA1 |
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R9A07G044L14GBG#AC0
Renesas Electronics
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1 | The RZ/G2L microprocessor includes a Cortex®-A55 (1.2 GHz) CPU, 16-bit DDR3L / DDR4 interface, 3D graphics engine with Arm Mali-G31 and video codec (H.264). It also has many interfaces such as camera input, display output, USB 2.0, and Gbit-Ether, making it ideal for applications such as entry-class industrial human-machine interfaces (HMIs) and embedded devices with video capabilities.As a software platform for this product, Renesas provides the Verified Linux Package, which includes the Linux Kernel, midd | BGA | R9A07G044L14GBG#AC0 |
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STM32MP133DAF7
STMicroelectronics
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1 | Arm® Cortex®-A7 up to 1 GHz, 2×ETH, 2×CAN FD, 2×ADC, 24 timers, audio | BGA | STM32MP133DAF7 |
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STM32MP233AAK3
STMicroelectronics
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1 | Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU, AI, 3D GPU, video decoder, TFT/DSI/LVDS, USB 2.0 | Other | STM32MP233AAK3 |
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STM32MP135CAF3T
STMicroelectronics
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1 | Arm® Cortex®-A7 up to 1 GHz, LCD-TFT, camera interface, 2×ETH, 2×CAN FD, 2×ADC, 24 timers, audio, crypto and adv. security | BGA | STM32MP135CAF3T |
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R9A07G054L23GBG#AC0
Renesas Electronics
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1 | RZ/V2L is equipped with a Cortex®-A55 (1.2GHz) CPU and built-in AI accelerator "DRP-AI" for vision, which is Renesas' original technology. "DRP-AI" is configured with DRP and AI-MAC. It also has a 16-bit DDR3L/DDR4 interface and a built-in 3D graphics engine with Arm Mali-G31 and video codec (H.264).DRP-AI’s excellent power efficiency eliminates the need for heat dissipation measures such as heat sinks or cooling fans. AI can be implemented cost efficiently not only in consumer electronics and industrial eq | BGA | R9A07G054L23GBG#AC0 |
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STM32MP255CAJ3
STMicroelectronics
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1 | Includes ST state-of-the-art patented technology.Cores• Up to 64-bit dual-core Arm® Cortex®-A35– Up to 1.5 GHz– 32-Kbyte I + 32-Kbyte D level 1 cache for each core– 512-Kbyte unified level 2 cache– Arm® NEON™ and Arm® TrustZone®• 32-bit Arm® Cortex®-M33 with FPU/MPU– Up to 400 MHz– L1 16-Kbyte I / 16-Kbyte D– Arm® TrustZone® | BGA | STM32MP255CAJ3 |
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STM32MP251DAL3
STMicroelectronics
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1 | Arm® based dual Cortex®-A35 1.5 GHz + Cortex®-M33 MPU with AI, 3D GPU, video encoder/decoder, TFT/DSI/LVDS, USB 3.0, PCIe® | BGA | STM32MP251DAL3 |
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