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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	FS32V234CON1VUB NXP	1	MPU RISC 32bit/64bit 1GHz Automotive 621-Pin FCBGA Tray	BGA	FS32V234CON1VUB	3D model available Symbol and footprint available 3	1 Download Model
	ATSAMA5D26A-CU Microchip	1	Atmel BGA GREEN, IND TEMP,MRLA	BGA	ATSAMA5D26A-CU	3D model available Symbol and footprint available 3	1 Download Model
	Z8018010PSG LITTELFUSE	1	Zilog Z8018010PSG, Microprocessor Z180 8bit CISC 10MHz 64-Pin PDIP	Dual-In-Line Packages	Z8018010PSG	3D model available Symbol and footprint available 3	1 Download Model
	TMPM4KLFYUG Toshiba	1	TMPM4KLFYUG	Quad Flat Packages	TMPM4KLFYUG	3D model available Symbol and footprint available 3	1 Download Model

	ATSAMA5D41B-CUR Microchip	1	Microprocessors - MPU BGA GREEN, IND	BGA	ATSAMA5D41B-CUR	3D model available Symbol and footprint available 3	1 Download Model
	66AK2H05DAAW2 Texas Instruments	1	Digital Signal Processors & Controllers - DSP, DSC HAWKING 1.2GHZ DSP 1.2GHZ ARM 0-85C	BGA	66AK2H05DAAW2	3D model available Symbol and footprint available 3	1 Download Model
	FS32R274VBK2VMM NXP	1	32-bit Microcontrollers - MCU S32R27 multicore Power Architecture, 200 MHz, ISO 26262, AEC-Q100 - S32R MCUs for Radar applications	BGA	FS32R274VBK2VMM	3D model available Symbol and footprint available 3	1 Download Model
	MPC8314ECVRADDA NXP	1	PowerQUICC II Pro Processor	BGA	MPC8314ECVRADDA	3D model available Symbol and footprint available 3	1 Download Model
	SVF321R3K1CKU2 NXP	1	Microprocessors - MPU 1.5M M4 A5-266 Open VG	Quad Flat Packages	SVF321R3K1CKU2	3D model available Symbol and footprint available 3	1 Download Model
	AM3358ZCZ72 Texas Instruments	1	Microprocessors - MPU AM33X ARM CORTEX-A8 - ARM CORTEX-A8 MICROPROCESSOR	BGA	AM3358ZCZ72	3D model available Symbol and footprint available 3	1 Download Model
	AM3359ZCZD27 Texas Instruments	1	Microprocessors - MPU AM33X ARM CORTEX-A8 - ARM CORTEX-A8 MICROPROCESSOR	BGA	AM3359ZCZD27	3D model available Symbol and footprint available 3	1 Download Model
	AT91SAM9G25-CU-999 Microchip	1	Microprocessors - MPU BGA Green IND TEMP MRL A,T&R	BGA	AT91SAM9G25-CU-999	3D model available Symbol and footprint available 3	1 Download Model
	MC68040RC25V NXP	1	68040 Microprocessor IC M680x0 1 Core, 32-Bit 25MHz 182-PGA (47.24x47.24)	Other	MC68040RC25V	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP157DAC1 STMicroelectronics	1	Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog	Other	STM32MP157DAC1	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP157FAD1 STMicroelectronics	1	Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto	Other	STM32MP157FAD1	3D model available Symbol and footprint available 3	1 Download Model

	STM32MP157DAD1 STMicroelectronics	1	Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog	Other	STM32MP157DAD1	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP135DAF7U STMicroelectronics	0	Arm® Cortex®-A7 up to 1 GHz, LCD-TFT, camera interface, 2×ETH,2×CAN FD, 2×ADC, 24 timers, audio	BGA	STM32MP135DAF7U	3D model available Symbol and footprint available 3	1 Download Model
	MD80C88/B Renesas Electronics	1	The Renesas 80C88 high performance 8-/16-bit CMOS CPU is manufactured using a self-aligned silicon gate CMOS process (Scaled SAJI IV). Two modes of operation, Minimum for small systems and Maximum for larger applications such as multiprocessing, allow user configuration to achieve the highest performance level. Full TTL compatibility (with the exception of CLOCK) and industry-standard operation allow use of existing NMOS 8088 hardware and Renesas CMOS peripherals. Complete software compatibility with the 80	Ceramic Dual-In-Line Packages	MD80C88/B	3D model not available Symbol and footprint available 2	1 Download Model
	STM32MP257CAK3 STMicroelectronics	1	MPU with Dual Arm Cortex-A35 @1.2GHz, Cortex-M33 @400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA	Other	STM32MP257CAK3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP251FAJ3 STMicroelectronics	1	Includes ST state-of-the-art patented technology.Cores• Up to 64-bit dual-core Arm® Cortex®-A35– Up to 1.5 GHz– 32-Kbyte I + 32-Kbyte D level 1 cache for each core– 512-Kbyte unified level 2 cache– Arm® NEON™ and Arm® TrustZone®• 32-bit Arm® Cortex®-M33 with FPU/MPU– Up to 400 MHz– L1 16-Kbyte I / 16-Kbyte D– Arm® TrustZone®	BGA	STM32MP251FAJ3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP133DAG7 STMicroelectronics	1	Arm® Cortex®-A7 up to 1 GHz, 2×ETH, 2×CAN FD, 2×ADC, 24 timers, audio	BGA	STM32MP133DAG7	3D model available Symbol and footprint available 3	1 Download Model
	R9A07G054L14GBG#AC0 Renesas Electronics	1	RZ/V2L is equipped with a Cortex®-A55 (1.2GHz) CPU and built-in AI accelerator "DRP-AI" for vision, which is Renesas' original technology. "DRP-AI" is configured with DRP and AI-MAC. It also has a 16-bit DDR3L/DDR4 interface and a built-in 3D graphics engine with Arm Mali-G31 and video codec (H.264).DRP-AI’s excellent power efficiency eliminates the need for heat dissipation measures such as heat sinks or cooling fans. AI can be implemented cost efficiently not only in consumer electronics and industrial eq	BGA	R9A07G054L14GBG#AC0	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP131AAG3 STMicroelectronics	1	Arm® Cortex®-A7 up to 1 GHz, 1×ETH, 1×ADC, 24 timers, audio	BGA	STM32MP131AAG3	3D model available Symbol and footprint available 3	1 Download Model
	STM32MP157CAB3 STMicroelectronics	1	Arm® dual Cortex®-A7 800 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto	BGA	STM32MP157CAB3	3D model available Symbol and footprint available 3	1 Download Model
	R9A07G054L28GBG#AC0 Renesas Electronics	1	RZ/V2L is equipped with a Cortex®-A55 (1.2GHz) CPU and built-in AI accelerator "DRP-AI" for vision, which is Renesas' original technology. "DRP-AI" is configured with DRP and AI-MAC. It also has a 16-bit DDR3L/DDR4 interface and a built-in 3D graphics engine with Arm Mali-G31 and video codec (H.264).DRP-AI’s excellent power efficiency eliminates the need for heat dissipation measures such as heat sinks or cooling fans. AI can be implemented cost efficiently not only in consumer electronics and industrial eq	BGA	R9A07G054L28GBG#AC0	3D model available Symbol and footprint available 3	1 Download Model
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