SMB59 Model Download Search Results
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1SMB5914BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5914BT3G |
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1SMB5931BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5931BT3G |
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1SMB5937
PANJIT
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1 | Zener Diodes - 1SMB5937 , 1500mW, 5V, 3330, SMB | Diodes Moulded | 1SMB5937 |
3
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1SMB5943BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5943BT3G |
3
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1SMB5922-AU
PANJIT
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1 | Zener Diodes - 1SMB5922-AU , AEC-Q101, 1500mW, 5V, 7.56.8, SMB | Diodes Moulded | 1SMB5922-AU |
3
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1SMB5923-AU
PANJIT
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1 | Zener Diodes - 1SMB5923-AU , AEC-Q101, 1500mW, 5V, 8.27.5, SMB | Diodes Moulded | 1SMB5923-AU |
3
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1SMB5926-AU
PANJIT
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1 | Zener Diodes - 1SMB5926-AU , AEC-Q101, 1500mW, 5V, 1110, SMB | Diodes Moulded | 1SMB5926-AU |
3
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1SMB5928-AU
PANJIT
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1 | Zener Diodes - 1SMB5928-AU , AEC-Q101, 1500mW, 5V, 1312, SMB | Diodes Moulded | 1SMB5928-AU |
3
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1SMB5937-AU
PANJIT
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1 | Zener Diodes - 1SMB5937-AU , AEC-Q101, 1500mW, 5V, 3330, SMB | Diodes Moulded | 1SMB5937-AU |
3
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S1Z1SMB5919BT3G
onsemi
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1 | Zener Diodes ZEN SMB REG 3W SPCL TR | Diodes Moulded | S1Z1SMB5919BT3G |
3
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1SMB5950 R5
Taiwan Semiconductor
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1 | Zener Diodes 3W,110V,5%,ZENER,SMB | Diodes Moulded | 1SMB5950 R5 |
3
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1SMB5937B-13
Diodes Incorporated
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1 | Zener Diodes 3.0W SM POWER ZENER 6.2V 39V 200mA 1.2 | Diodes Moulded | 1SMB5937B-13 |
3
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1SMB5948
Taiwan Semiconductor
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1 | Zener Diode 91 V 3 W ±5% Surface Mount DO-214AA (SMB) | Diodes Moulded | 1SMB5948 |
3
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1SMB5926
PANJIT
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1 | Zener Diodes - 1SMB5926 , 1500mW, 5V, 1110, SMB | Diodes Moulded | 1SMB5926 |
3
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1SMB5916BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5916BT3G |
3
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SZ1SMB5949BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5949BT3G |
3
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1SMB5934BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5934BT3G |
3
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1SMB5946BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5946BT3G |
3
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1SMB5929
PANJIT
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1 | Zener Diodes - 1SMB5929 , 1500mW, 5V, 1513, SMB | Diodes Moulded | 1SMB5929 |
3
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1SMB5932BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5932BT3G |
3
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SZ1SMB5933BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5933BT3G |
3
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1SMB5940-AU
PANJIT
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1 | Zener Diodes - 1SMB5940-AU , AEC-Q101, 1500mW, 5V, 4339, SMB | Diodes Moulded | 1SMB5940-AU |
3
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SZ1SMB5941BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | SZ1SMB5941BT3G |
3
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1SMB5953BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5953BT3G |
3
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1SMB5935BT3G
onsemi
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1 | Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi | Diodes Moulded | 1SMB5935BT3G |
3
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![Part Image](["https://www.panjit.com.tw/upload/2023_04_1319/20230413155934rj041dbQI1.jpg","https://www.panjit.com.tw/upload/2023_04_1319/20230413155934rj041dbQI1.jpg","//content.supplyframe.com/images/process/fit-in/100x100/p/do214_2.jpg"])
![Part Image](["https://www.panjit.com.tw/upload/2023_04_1319/20230413155934rj041dbQI1.jpg","https://www.panjit.com.tw/upload/2023_04_1319/20230413155934rj041dbQI1.jpg",null])
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