W29N0 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W29N08GVBIAA Winbond	1	8Gb SLC NAND Flash MHz VFBGA63	BGA	W29N08GVBIAA	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KZDIBE Winbond	1	2Gb SLC NAND Flash MHz VFBGA48	BGA	W29N02KZDIBE	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GVSIAF Winbond	1	8Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N08GVSIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVBIAA Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04GVBIAA	3D model available Symbol and footprint available 3	1 Download Model

	W29N04GVSIAF Winbond	1	• Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology.• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms(	Small Outline Packages	W29N04GVSIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GZSJBF Winbond	1	SLC NAND Flash MHz	Small Outline Packages	W29N04GZSJBF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVBJAF Winbond	1	Basic Features– Density: 4Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature▪ Industrial: -40°C to 85°C• Single-Level Cell (SLC) technology.• Organization– Density: 4G-bit/512M-byte– Page size▪ 2,112 bytes (2048 + 64 bytes)– Block size▪ 64 pages (128K + 4K bytes)• Highest Performance– Read performance (Max.)▪ Random read: 25us▪ Sequential read cycle: 25ns– Write Erase performance▪ Page program time: 250us(typ.)▪ Block erase time: 2ms(ty	BGA	W29N04GVBJAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GZSIBA Winbond	1	4Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N04GZSIBA	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HVSINA Winbond	1	1Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N01HVSINA	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVSIAF Winbond	1	 Basic Features– Density: 2Gbit (Single chip solution)– Vcc: 2.7V to 3.6V– Bus width: x8– Operating temperature Industrial: -40°C to 85°C Single-Level Cell (SLC) technology Organization– Density: 2G-bit/256M-byte– Page size 2,176 bytes– Block size 64 pages Highest Performance– Read performance (Max.) Random read: 25us Sequential read cycle: 25ns– Write Erase performance Page program time: 250us (typ.) Block erase time: 2ms (typ.)– Endurance: 60,000 Erase/Pr	Small Outline Packages	W29N02KVSIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVBJAA Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04GVBJAA	3D model available Symbol and footprint available 3	1 Download Model
	W29N02GZBIBA Winbond	1	2Gb SLC NAND Flash MHz VFBGA63	BGA	W29N02GZBIBA	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZBJNF Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HZBJNF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GVBIAF Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04GVBIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GVSIAA Winbond	1	8Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N08GVSIAA	3D model available Symbol and footprint available 3	1 Download Model

	W29N02GVBIAF Winbond	1	2Gb SLC NAND Flash Memory with uniform 2KB+64B page size	BGA	W29N02GVBIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N01GVSCAA Winbond	1	W29N01HVXINF 1G-BIT 3.3V NAND FLASH MEMORY	Small Outline Packages	W29N01GVSCAA	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GZBJBF Winbond	1	Basic Features– Density : 8Gbit (2 chip stacked solution)– Vcc : 1.7V to 1.95V– Bus width : x8/x16– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 8G-bit/1G-byte– Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words)– Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) Highest Performance– Read performance (Max.) Random read: 25us Sequential	BGA	W29N08GZBJBF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GZBIBF Winbond	1	Basic Features– Density : 4Gbit (Single chip solution)– Vcc : 1.7V to 1.95V– Bus width : x8 x16– Operating temperature Industrial: -40°C to 85°C Industrial Plus: -40°C to 105°C Single-Level Cell (SLC) technology. Organization– Density: 4G-bit/512M-byte– Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words)– Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) Highest Performance– Read performance (Max.) Random read: 25us Sequential	BGA	W29N04GZBIBF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GZBJBF Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04GZBJBF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GZBIBA Winbond	1	4Gb SLC NAND Flash MHz VFBGA63	BGA	W29N04GZBIBA	3D model available Symbol and footprint available 3	1 Download Model
	W29N02KVDIAF Winbond	1	2Gb SLC NAND Flash Memory with uniform 2KB+128B page size	BGA	W29N02KVDIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N08GVBIAF Winbond	1	 Basic Features– Density : 8Gbit (2 chip stacked solution)– Vcc : 2.7V to 3.6V– Bus width : x8– Operating temperature Industrial: -40°C to 85°C Single-Level Cell (SLC) technology. Organization– Density: 8G-bit/1G-byte– Page size 2,112 bytes (2048 + 64 bytes)– Block size 64 pages (128K + 4K bytes) Highest Performance– Read performance (Max.) Random read: 25us Sequential read cycle: 25ns– Write Erase performance Page program time: 250us(typ.) Block erase time:	BGA	W29N08GVBIAF	3D model available Symbol and footprint available 3	1 Download Model
	W29N04GZSIBF Winbond	1	4Gb SLC NAND Flash MHz TSOPI48	Small Outline Packages	W29N04GZSIBF	3D model available Symbol and footprint available 3	1 Download Model
	W29N01HZBINA Winbond	1	1Gb SLC NAND Flash MHz VFBGA63	BGA	W29N01HZBINA	3D model available Symbol and footprint available 3	1 Download Model
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