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2624-1306
Wago
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1 | PCB terminal block; 4 mm²; Pin spacing 7.5 mm; 6-pole; Push-in CAGE CLAMP® | Other | 2624-1306 |
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2091-1306/200-000
Wago
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1 | THR female header; straight; Pin spacing 3.5 mm; 6-pole; 0.4 x 0.9 mm solder pin | Other | 2091-1306/200-000 |
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52271-3069
Molex
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1 | Molex FFC/FPC SMT 52271 Series 1mm Pitch 30 Way Right Angle SMT Female FPC Connector, ZIF Bottom Contact | Other | 52271-3069 |
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TVA1306
Vishay
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1 | Aluminum Electrolytic Capacitors - Axial Leaded 50V 25 uF | Capacitors, Polarized Axial Diameter Horizontal Mounting | TVA1306 |
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XM0L1306QDYYRQ1
Texas Instruments
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1 | SOT-23-THIN - 1.1 mm max height | Small Outline Packages | XM0L1306QDYYRQ1 |
3
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M0L1306QDGS20RQ1
Texas Instruments
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1 | ARM® Cortex®-M0+ MSPM0 L Microcontroller IC 32-Bit 32MHz 64KB (64K x 8) FLASH 20-VSSOP | Small Outline Packages | M0L1306QDGS20RQ1 |
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AMC1306E05DWVR
Texas Instruments
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1 | Small Reinforced Isolated Modulator With ±50mV Input and Manchester-Encoded CMOS Interface | Small Outline Packages | AMC1306E05DWVR |
3
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AMDLA1306Q-470MT
ABRACON
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1 | Power Inductors - SMD IND 47uH 5.7A 67mOhm | Inductors Precision Moulded | AMDLA1306Q-470MT |
3
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AMC1306M25DWVR
Texas Instruments
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1 | Small reinforced isolated modulator with ±250-mV input and CMOS interface | Small Outline Packages | AMC1306M25DWVR |
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MSPM0L1306TRGER
Texas Instruments
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1 | ARM Microcontrollers - MCU 32-MHz Arm® Cortex®-M0+ MCU with 64-KB flash, 4-KB SRAM, 12-bit ADC, comparator, OPA 24-VQFN -40 to 105 | Quad Flat No-Lead | MSPM0L1306TRGER |
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105313-1306
Molex
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1 | Connector Header Through Hole, Right Angle 6 position 0.098" (2.50mm) | Other | 105313-1306 |
3
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NSI1306C25-DSWVR
NOVOSENSE
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1 | NSI1306C: High Reliability Reinforced Isolated Sigma-Delta Modulator (ADC) | Small Outline Packages | NSI1306C25-DSWVR |
3
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R5F51306BDFK#50
Renesas Electronics
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1 | Quad Flat Packages | R5F51306BDFK#50 |
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MSPM0L1306TDGS20R
Texas Instruments
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1 | ARM® Cortex®-M0+ - Microcontroller IC 32-Bit 32MHz 64KB (64K x 8) FLASH 20-VSSOP ,1.62V ~ 3.6V ,-40°C ~ 105°C (TA) | Small Outline Packages | MSPM0L1306TDGS20R |
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DS1306N+
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - DS1306N+ - Alarm RTC IC, Date Time Format (Day/Date/Month/Year hh:mm:ss), SPI, 2 V to 5.5 V, DIP-16 | Dual-In-Line Packages | DS1306N+ |
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105314-1306
Molex
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1 | Headers & Wire Housings NanoFit RA Hdr TH DR 6Ckt 0.76um Au Blk | Other | 105314-1306 |
3
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LT1306ES8#PBF
Analog Devices
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1 | IC REG BOOST 5V 2.3A 8SOIC | Small Outline Packages | LT1306ES8#PBF |
3
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NSI1306M25-DSWVR
NOVOSENSE
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1 | ISO C-SENSING MODULATOR | Small Outline Packages | NSI1306M25-DSWVR |
3
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MSPM0L1306SRHBR
Texas Instruments
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1 | ARM Microcontrollers - MCU 32-MHz Arm® Cortex®-M0+ MCU with 64-KB flash, 4-KB SRAM, 12-bit ADC, comparator, OPA 32-VQFN -40 to 125 | Quad Flat No-Lead | MSPM0L1306SRHBR |
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EKMB1306112K
Panasonic
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1 | PANASONIC - EKMB1306112K - PIR SENSOR, DIGITAL, 17M, 4V, BLACK | Other | EKMB1306112K |
3
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SSW-113-06-S-S
SAMTEC
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1 | 13 Position, .100" Tiger Buy™ Socket Strip | Other | SSW-113-06-S-S |
2
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TMMH-113-06-H-T
SAMTEC
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1 | 39 Position, Low Profile Header Strips with End Shroud, 2.00 mm Pitch | Other | TMMH-113-06-H-T |
3
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09291306574
HARTING
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1 | Connectors, Male connector, Press-in termination, Wrap termination, Rated current: 2 A, Contacts: 30, Straight | Other | 09291306574 |
3
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R5F51306BGFK#30
Renesas Electronics
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1 | The RX130 Group integrates a built-in max. 36-channel capacitive touch sensor. The capacitive touch sensor uses an improved detection method compared to previous products and so has vastly improved noise immunity, sensitivity and water resistance. As a result, malfunctions have been reduced, and touch keys are now able to be applied to a variety of materials like e.g. wood, other than the typical acrylic or glass: The RX130 touch feature is an ideal fit for consumer electronics products that are used in wet | Quad Flat Packages | R5F51306BGFK#30 |
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SSW-113-06-L-S
SAMTEC
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1 | 13 Position, .100" Tiger Buy™ Socket Strip | Other | SSW-113-06-L-S |
2
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![Part Image](["https://componentsearchengine.com/2D/0/17637178.png",null,null])
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