5-877 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	C155877 Shenzhen Cankemeng	1	Wire To Board / Wire To Wire Connector Plugin P=2mm RoHS	Header, Shrouded - Right Angle PTH Box	C155877	3D model available Symbol and footprint available 3	1 Download Model
	TC358775XBG Toshiba	1	Display Interface Bridge 64-Pin VFBGA	BGA	TC358775XBG	3D model available Symbol and footprint available 3	1 Download Model
	09676158775 HARTING	1	D-Sub IP67 15pin female, straight solder pins, rear metal mounting, w/ M3 thread, board locks, PLS4	Other	09676158775	3D model available Symbol and footprint available 3	1 Download Model
	09675258775 HARTING	1	D-Sub IP67 25pin female, straight solder pins, rear plastic mounting, w/ M3 thread, board locks, PLS4	Other	09675258775	3D model available Symbol and footprint available 3	1 Download Model

	TC358779XBG Toshiba	1	Display Drivers & Controllers	BGA	TC358779XBG	3D model available Symbol and footprint available 3	1 Download Model
	225877 TE Connectivity	1	Power Element, Female Thread M6, SMT	Other	225877	3D model available Symbol and footprint available 3	1 Download Model
	09676258775 HARTING	1	D-Sub IP67 25pin female, straight solder pins, rear metal mounting, w/ M3 thread, board locks, PLS4	Other	09676258775	3D model available Symbol and footprint available 3	1 Download Model
	215877-1 TE Connectivity	1	Body Features: Modular Jack Latch Orientation Standard - Latch Down \| Connector Profile Low \| Configuration Features: Connector Contact Density Standard \| Number of Positions 8 \| Status Light Type Not Illuminated \| Number of Loaded Positions 8 \| Port Configuration Single Port \| PCB Mount Orientation Right Angle \| Port Matrix Configuration 1 x 1 \| Contact Features: Contact Base Material Phosphor Bronze \| Contact Current Rating (Max) 1.5 AMP \| Contact Mating Area Plating Material Nickel \| Contact Mating Area	Other	215877-1	3D model available Symbol and footprint available 3	1 Download Model
	1358770000 Weidmüller This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	PCB connector (board connection), 160 V, 13.4 A, Pitch in mm: 3.50, Number of poles: 10, THT/THR solder connection, Tape	Other	1358770000	3D model available Symbol and footprint available 3	1 Download Model
	09675158775 HARTING	1	D-Sub IP67 15pin female, straight solder pins, rear plastic mounting, w/ M3 thread, board locks, PLS4	Other	09675158775	3D model available Symbol and footprint available 3	1 Download Model
	3-215877-1 TE Connectivity	1	Body Features: Connector Profile Low \| Modular Jack Latch Orientation Standard - Latch Down \| Configuration Features: Port Matrix Configuration 1 x 1 \| Connector Contact Density Standard \| Number of Loaded Positions 8 \| Port Configuration Single Port \| Number of Positions 8 \| Status Light Type Not Illuminated \| PCB Mount Orientation Right Angle \| Contact Features: Contact Base Material Phosphor Bronze \| Contact Mating Area Plating Material Nickel \| Contact Mating Area Plating Material Thickness 1.27 MICM \|	Other	3-215877-1	3D model available Symbol and footprint available 3	1 Download Model
	TC358770AXBG Toshiba	1	CMOS Digital Integrated Circuit Silicon Monolithic	BGA	TC358770AXBG	3D model available Symbol and footprint available 3	1 Download Model
	TC358772XBG Toshiba	1	Display Drivers & Controllers	BGA	TC358772XBG	3D model available Symbol and footprint available 3	1 Download Model
	TC358771XBG Toshiba	1	CMOS Digital Integrated Circuit Silicon Monolithic	BGA	TC358771XBG	3D model available Symbol and footprint available 3	1 Download Model
	TC358778XBG(EL) Toshiba	1	Interface - Specialized Display Interface Bridge	BGA	TC358778XBG(EL)	3D model available Symbol and footprint available 3	1 Download Model

	TC358777XBG Toshiba	1	TC358777XBG ; Toshiba Package Name, P-VFBGA80-0707-0.65-001 ; Pins, 80 ; Mounting, Surface Mount ; Package size, 7mm×7mm ; Pin pitch, 0.65 mm ...	BGA	TC358777XBG	3D model available Symbol and footprint available 3	1 Download Model
	NVMFD5877NLWFT1G-UM onsemi	1	Low on resistance; Low Capacitance; NVMFD5877NLWF − Wettable Flanks Option for Enhanced Optical Inspection; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant	Other	NVMFD5877NLWFT1G-UM	3D model available Symbol and footprint available 3	1 Download Model
	TC358778XBG Toshiba	1	CMOS Digital Integrated Circuit Silicon Monolithic	BGA	TC358778XBG	3D model available Symbol and footprint available 3	1 Download Model
	TC358774XBG Toshiba	1	MIPI® DSI℠ 1.01 to LVDS (Single Link) / Up to UXGA (1600 x 1200, 60 fps, 24 bpp)	BGA	TC358774XBG	3D model available Symbol and footprint available 3	1 Download Model
	MAX5877EGK+TD Analog Devices	1	14-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS Inputs	Quad Flat No-Lead	MAX5877EGK+TD	3D model available Symbol and footprint available 3	1 Download Model
	MAX5877EGK+D Analog Devices	1	14-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS Inputs	Quad Flat No-Lead	MAX5877EGK+D	3D model available Symbol and footprint available 3	1 Download Model
	NVMFD5877NLT1G onsemi	1	MOSFET - Power, Dual N-Channel, Logic Level, Dual SO8FL, 60 V, 39 m, 17 A	Other	NVMFD5877NLT1G	3D model available Symbol and footprint available 3	1 Download Model
	5-87733-0 TE Connectivity	1	Board Connector, 64 Contact(s), 2 Row(s), Female, Wire Terminal		5-87733-0	3D model not available Symbol and footprint not available 0	0 Build or Request
	5-87733-0 TE's AMP	1	64 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR		5-87733-0	3D model not available Symbol and footprint not available 0	0 Build or Request
	78587-703HLF Amphenol FCi	1	Board Connector, 3 Contact(s), 1 Row(s), Male, Right Angle, Solder Terminal		78587-703HLF	3D model not available Symbol and footprint not available 0	0 Build or Request
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