86-10 Model Download Search Results
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86-1031-1100-00008
Binder
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1 | BINDER - 86-1031-1100-00008 - SENSOR CONN, PLUG, 5POS, M12, PANEL | Other | 86-1031-1100-00008 |
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86-1031-1100-00004
Binder
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1 | BINDER - 86-1031-1100-00004 - SENSOR CONN, PLUG, 8POS, M12, PANEL | Other | 86-1031-1100-00004 |
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502386-1070
Molex
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1 | Molex CLIK-MATE Series 1.25mm 10 Way 1 Row Right Angle PCB Socket Surface Mount Wire to Board | Other | 502386-1070 |
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245861010004829+
Kyocera AVX
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1 | Conn Board to Board RCP 10 POS 0.35mm Solder ST Top Entry SMD | Other | 245861010004829+ |
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1728610000
Weidmüller
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1 | PCB connector (board connection), 125 V, 10 A, Pitch in mm: 3.50, Number of poles: 34, THT solder connection, Box | Other | 1728610000 |
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15286102
Molex
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1 | Mini-Fit BMI Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 10 Circuits, PA Polyamide Nylon 6/6 | Other | 15286102 |
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MKP1848610914P4
Vishay
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1 | 10 µF Film Capacitor 1100V (1.1kV) Polypropylene (PP), Metallized Radial - 4 Leads | Other | MKP1848610914P4 |
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744778610
Würth Elektronik
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1 | WE-PD Robust SMT Shielded Power Inductor Size 6050; L = 10 µH ; IR = 2.2 A; Isat = 1.8 A; RDC = 88 mΩ | Other | 744778610 |
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FDS86106
onsemi
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1 | High power and current handling capability in a widely used surface mount package; Max rDS(on) = 171 mΩ at VGS = 6 V, ID/ = 2.7 A; 100% UIL Tested; Max rDS(on)= 105 mΩ at VGS = 10 V, ID = 3.4 A; RoHS Compliant; High performance trench technology for extremely low rDS(on) | Small Outline Packages | FDS86106 |
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FDD86102
onsemi
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1 | High power and current handling capability in a widely used surface mount package ; High performance trench technology for extremely low rDS(on) ; 100% UIL tested ; RoHS Compliant ; Max rDS(on) = 24 mΩ at VGS = 10 V, ID = 8 A ; Max rDS(on) = 38 mΩ at VGS = 6 V, ID = 6 A ; Very low Qg and Qgd compared to competing trench technologies; Fast switching speed | Other | FDD86102 |
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5023861071
Molex
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1 | 1.25mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Right-Angle, Gold (Au) Plating, 10 Circuits | Other | 5023861071 |
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5023861070
Molex
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1 | 1.25mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Right-Angle, Tin (Sn) Plating, 10 Circuits | Other | 5023861070 |
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15286101
Molex
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1 | Mini-Fit BMI Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 10 Circuits, PA Polyamide Nylon 6/6 | Other | 15286101 |
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FDMS86103L
onsemi
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1 | Advanced Package and Silicon combination for low rDS(on) and high efficiency ; 100% UIL tested ; RoHS Compliant ; Max rDS(on) = 8 mΩ at VGS = 10 V, ID = 12 A ; Max rDS(on) = 11 mΩ at VGS = 4.5 V, ID = 10 A ; MSL1 robust package design ; Shielded Gate MOSFET Technology | Other | FDMS86103L |
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FDMS86105
onsemi
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1 | 100% UIL tested; Advanced package and silicon combination for low rDS(on) and high efficiency; Max rDS(on) = 54 mΩ at VGS = 6 V, ID = 4.5 A; Max rDS(on) = 34 mΩ at VGS = 10 V, ID = 6 A; MSL1 robust package design; RoHS Compliant; Shielded Gate MOSFET Technology | Other | FDMS86105 |
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FDMS86101DC
onsemi
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1 | Max rDS(on) = 7.5 mΩ at VGS = 10 V, ID = 14.5 A ; Dual Cool™ Top Side Cooling PQFN package ; 100% UIL Tested ; Shielded Gate MOSFET Technology ; Max rDS(on) = 12 mΩ at VGS = 6 V, ID = 11.5 A ; RoHS Compliant ; High performance technology for extremely low rDS(on) | Other | FDMS86101DC |
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15-28-6101
Molex
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1 | Mini-Fit BMI Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 10 Circuits, PA Polyamide Nylon 6/6, without Drain Holes | Other | 15-28-6101 |
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15-28-6102
Molex
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1 | Mini-Fit BMI Header, 4.20mm Pitch, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 10 Circuits, PA Polyamide Nylon 6/6, without Drain Holes | Other | 15-28-6102 |
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FDMC86102LZ
onsemi
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1 | RoHS Compliant ; HBM ESD protection level > 6 KV typical (Note 4) ; Max rDS(on) = 35 mΩ at VGS = 4.5 V, ID = 5.5 A ; Max rDS(on) = 24 mΩ at VGS = 10 V, ID = 6.5 A ; 100% UIL Tested ; Shielded Gate MOSFET Technology | Other | FDMC86102LZ |
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FDMS86101
onsemi
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1 | Advanced Package and Silicon combination for low rDS(on) and high efficiency ; Max rDS(on) = 8 mΩ at VGS = 10 V, ID = 13 A ; RoHS compliant ; 100% UIL tested ; Max rDS(on) = 13.5 mΩ at VGS = 6 V, ID = 9.5 A ; MSL1 robust package design | Other | FDMS86101 |
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FDMD86100
onsemi
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1 | 100% UIL tested ; Max rDS(on) = 10.5 mΩ at VGS = 10 V, ID = 10 A ; Max rDS(on) = 17.3 mΩ at VGS = 6 V, ID = 7.8 A ; Ideal for flexible layout in secondary side synchronous rectification ; Termination is Lead-free and RoHS Compliant ; Shielded Gate MOSFET Technology ; Common source configuration to eliminate PCB routing; Large source pad on bottom of package for enhanced thermals | Other | FDMD86100 |
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FDMC86102
onsemi
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1 | 100% UIL Tested ; Low Profile - 1 mm max in Power 33 ; Max rDS(on) = 38 mΩ at VGS = 6 V, ID = 5 A ; Shielded Gate MOSFET Technology ; Max rDS(on) = 24 mΩ at VGS = 10 V, ID = 7 A ; RoHS Compliant | Other | FDMC86102 |
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FDB86102LZ
onsemi
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1 | RoHS Compliant; 100% UIL Tested; Fast switching speed; HBM ESD protection level > 6 kV typical (Note 4); Max rDS(on) = 24 mΩ at VGS = 10 V, ID = 8.3 A; Very low Qg and Qgd compared to competing trench technologies; Max rDS(on) = 35 mΩ at VGS = 4.5 V, ID = 6.8 A | Other | FDB86102LZ |
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FDT86106LZ
onsemi
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1 | HBM ESD protection level > 3 KV typical (Note 4); Max rDS(on) = 108 mΩ at VGS = 10 V, ID = 3.2 A; Max rDS(on) = 153 mΩ at VGS = 4.5 V, ID = 2.7 A; High power and current handling capability in a widely usedsurface mount package; 100% UIL tested; RoHS Compliant; High performance trench technology for extremely low rDS(on) | SOT223 (3-Pin) | FDT86106LZ |
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FDMS86101A
onsemi
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1 | MSL1 robust package design ; 100% Rg tested; Max rDS(on) = 13.5 mΩ at VGS = 6 V, ID = 9.5 A ; Advanced Package and Silicon combination for low rDS(on) and high efficiency ; 100% UIL tested ; RoHS Compliant ; Max rDS(on) = 8 mΩ at VGS = 10 V, ID = 13 A ; Shielded Gate MOSFET Technology | Other | FDMS86101A |
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