940-9 Model Download Search Results
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FDD9409LF085
onsemi
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1 | MOSFET N-channel Power Trench MOSFET | Other | FDD9409LF085 |
3
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MIC94092YC6 TR
Microchip
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1 | Power Switch/Driver 1:1 P-Channel 1.2A SC-70-6 | SOT23 (6-Pin) | MIC94092YC6 TR |
3
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MIC94090YC6-TR
Microchip
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1 | Power Switch ICs - Power Distribution High Side Load Switch 1.2A, 130m | SOT23 (6-Pin) | MIC94090YC6-TR |
3
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MIC94092YC6-TR
Microchip
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1 | Power Switch ICs - Power Distribution High Side Load Switch 1.2A, 130m | SOT23 (6-Pin) | MIC94092YC6-TR |
3
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MIC94095YC6-TR
Microchip
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1 | Power Switch ICs - Power Distribution High Side Load Switch 1.2A, 130m | SOT23 (6-Pin) | MIC94095YC6-TR |
3
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X9409YV24I-2.7
Renesas Electronics
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1 | Digital Potentiometer ICs | Small Outline Packages | X9409YV24I-2.7 |
3
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FDD9409L-F085
onsemi
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1 | UIS Capability ; Typical Qg(tot) = 52 nC at VGS = 10V, ID = 80 A ; RoHS Compliant ; Qualified to AEC Q101 ; Typical RDS(on) = 2.1 mΏ at VGS = 10V, ID = 80 A | Other | FDD9409L-F085 |
3
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2309409-5
TE Connectivity
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1 | Body Features: Latch Material High Temperature Thermoplastic | Retention Post Location Both Ends | Ejector Type Locking | Ejector Location Both Ends | Module Key Type Offset Left | Connector Profile Low | Configuration Features: Number of Positions 260 | Number of Keys 1 | Number of Rows 2 | Module Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | Memory Socket Type Memory Card | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Mat | Other | 2309409-5 |
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BD9409F-E2
ROHM Semiconductor
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1 | 1ch Boost up type White LED Driver for large LCD | Small Outline Packages | BD9409F-E2 |
3
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2309409-3
TE Connectivity
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1 | Small Outline (SO), 5.2 mm [.205 in] Stack Height, Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets | Other | 2309409-3 |
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2309409-2
TE Connectivity
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1 | Body Features: Module Key Type Offset Left | Ejector Type Locking | Connector Profile Low | Retention Post Location Both Ends | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Number of Positions 260 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 5 MICIN | Memory Socket Type Memory Card | Contact Current Rating (Max) .5 AM | Other | 2309409-2 |
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PJL9409
PANJIT
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1 | Low Voltage MOSFET (20-40V,Rds(on)<1Ω) - PJL9409 , P Channel, Single, -6.5A, -30V, SOP-8 | Small Outline Packages | PJL9409 |
3
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2309409-1
TE Connectivity
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1 | Small Outline (SO), Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets | Other | 2309409-1 |
3
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MIC94094YC6-TR
Microchip
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1 | Power Switch ICs - Power Distribution High Side Load Switch 1.2A, 130m | Small Outline Packages | MIC94094YC6-TR |
3
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MIC94093YC6-TR
Microchip
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1 | Power Switch ICs - Power Distribution | SOT23 (6-Pin) | MIC94093YC6-TR |
3
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TSM9409CS
Taiwan Semiconductor
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1 | P-Channel 60 V 3.5A (Ta) 3W (Ta) Surface Mount 8-SOP | Small Outline Packages | TSM9409CS |
2
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L9409F
STMicroelectronics
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1 | Alternator voltage regulator with load response control | Transistor Outline, Vertical | L9409F |
3
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DG9409EDN-T1-GE4
Vishay
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1 | Dual 4:1 Analog Multiplexer 3-16V QFN16 | Quad Flat No-Lead | DG9409EDN-T1-GE4 |
3
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5962-3829409MXA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829409MXA |
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5962-3829409MZA
Renesas Electronics
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1 | The 5962-38294 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. The low-power version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. | Ceramic Dual-In-Line Packages | 5962-3829409MZA |
2
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DG9409DN-T1-E4
Vishay
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1 | Analog Multiplexers | Other | DG9409DN-T1-E4 |
2
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940-99-020-24-000000
Mill-Max Mfg Corp
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1 | IC Socket, PLCC20, 20 Contact(s), Solder | 940-99-020-24-000000 |
0
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940-99-032-17-40000
Mill-Max Mfg Corp
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1 | IC Socket | 940-99-032-17-40000 |
0
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940-99-044-24-000000
Mill-Max Mfg Corp
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1 | IC Socket, PLCC44, 44 Contact(s), Solder | 940-99-044-24-000000 |
0
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940-99-032-17-000000
Mill-Max Mfg Corp
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1 | IC Socket, PLCC32, 32 Contact(s) | 940-99-032-17-000000 |
0
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![Part Image](["https://componentsearchengine.com/Images/1/FDD9409L-F085.jpg",null,null])
![Part Image](["https://componentsearchengine.com/2D/0T/1180874.4.1.png",null,null])
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/002/309/409/2309409-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/002/309/409/2309409-t1.jpg/jcr:content/renditions/product-details.png",null])
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![Part Image](["https://componentsearchengine.com/Images/1/5962-3829409MXA.jpg",null,null])
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