Showing 25 of 281 results
| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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CY62256NLL-70SNXC
Alliance Memory
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1 | SRAM 256K 32K x 8 4.5-5.5V 28pin 330mil SOP Commercial (0 70 C) Low Power Asynch | Small Outline Packages | CY62256NLL-70SNXC |
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AS4C128M8D3B-12BIN
Alliance Memory
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1 | SDRAM - DDR3 Memory IC 1Gbit Parallel 800 MHz 20 ns 78-FBGA (8x10.5) | BGA | AS4C128M8D3B-12BIN |
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ASFC8G31M-51BIN
Alliance Memory
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1 | eMMC 8GB 64GB X 1 NAND - 3V - 153 Ball FBGA | BGA | ASFC8G31M-51BIN |
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M29F800FT55N3E2
Alliance Memory
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1 | NOR Flash NOR Flash(Micron) , PARALLEL, 8M , TSOP 48PIN, 55ns, -40-+125C, TOP, Tray | Small Outline Packages | M29F800FT55N3E2 |
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AS4C8M32SA-7BCN
Alliance Memory
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1 | DRAM SDRAM, 256Mb, 8M X 32, 3.3V, 90-ball FBGA, 143 MHz, Commercial Temp - Tray | BGA | AS4C8M32SA-7BCN |
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M29F160FB5AN6F2
Alliance Memory
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1 | NOR Flash Micron Parallel NOR Flash Embedded Memory Top/Bottom Boot Block 5V Supply | Small Outline Packages | M29F160FB5AN6F2 |
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AS7C1024B-12TCN
Alliance Memory
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1 | Industrial and commercial temperatures Organization: 131,072 words x 8 bits High speed 10/12/15/20 ns address access time 5/6/7/8 ns output enable access time Low power consumption: ACTIVE 605 mW / max @ 10 ns Low power consumption: STANDBY 55 mW / max CMOS Easy memory expansion with CE1, CE2, OE inputs TTL/LVTTL-compatible, three-state I/O32-pin JEDEC standard packages | Small Outline Packages | AS7C1024B-12TCN |
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AS7C34096A-10TIN
Alliance Memory
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1 | SRAM SRAM, 4Mb, 512K x 8, 3.3V, 44pin TSOP II, 10ns, Industrial Temp - Tray | Small Outline Packages | AS7C34096A-10TIN |
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AS6C6264-55SCNTR
Alliance Memory
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1 | SRAM 64K, 2.7-5.5V, 55ns 8K x 8 Asynch SRAM | Small Outline Packages | AS6C6264-55SCNTR |
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AS4C4M32SA-6TIN
Alliance Memory
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1 | DRAM SDRAM, 128MB, 4M X 32, 3.3V, 86PIN TSOP II, 166 MHZ INDUSTRIAL TEMP - Tray | Small Outline Packages | AS4C4M32SA-6TIN |
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U62256ADK07LLG1
Alliance Memory
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1 | SRAM ZMD 32K x 8 5V Asynch | Dual-In-Line Packages | U62256ADK07LLG1 |
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AS4C256M16D3LC-12BIN
Alliance Memory
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1 | DRAM SDRAM - DDR3L | BGA | AS4C256M16D3LC-12BIN |
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AS4C1G16D4-062BIN
Alliance Memory
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1 | DRAM DDR4, 16Gb, 1G x 16, 1.2v, 96-ball FBGA, 1600MHz, Industrial | BGA | AS4C1G16D4-062BIN |
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CY62256NLL-55SNXIT
Alliance Memory
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1 | ■ Temperature ranges❐ Commercial: 0 °C to +70 °C❐ Industrial: –40 °C to +85 °C❐ Automotive-A: –40 °C to +85 °C❐ Automotive-E: –40 °C to +125 °C■ High speed: 55 ns■ Voltage range: 4.5 V to 5.5 V operation■ Low active power❐ 275 mW (max)■ Low standby power (LL version)❐ 82.5 W (max)■ Easy memory expansion with CE and OE Features■ TTL-compatible inputs and outputs■ Automatic power-down when deselected■ CMOS for optimum speed and power■ Available in Pb-free and non Pb-free 28-pin | Small Outline Packages | CY62256NLL-55SNXIT |
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AS5F32G04SND-08LIN
Alliance Memory
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1 | NAND Flash | Small Outline No-lead | AS5F32G04SND-08LIN |
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AS6C4008-55PIN
Alliance Memory
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1 | SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM | Dual-In-Line Packages | AS6C4008-55PIN |
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AS7C3513B-20TCN
Alliance Memory
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1 | IC SRAM 512K PARALLEL 44TSOP II | Small Outline Packages | AS7C3513B-20TCN |
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AS4C16M16SA-6TCN
Alliance Memory
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1 | 256M – (16Mx16bit) Synchronous DRAM (SDRAM) | Small Outline Packages | AS4C16M16SA-6TCN |
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AS4C16M32SC-7TIN
Alliance Memory
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1 | DRAM 512Mb 16Mx32 3.3V 143MHz SDRAM I-Temp | Small Outline Packages | AS4C16M32SC-7TIN |
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AS4C16M16SA-6TIN
Alliance Memory
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1 | SDRAM Memory IC 256Mb (16M x 16) Parallel 166 MHz 5 ns 54-TSOP II | Small Outline Packages | AS4C16M16SA-6TIN |
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AS4C4M16SA-7BCN
Alliance Memory
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1 | DRAM | BGA | AS4C4M16SA-7BCN |
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MT41K512M16HA-107:A
Alliance Memory
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1 | DRAM 8G - monolithic die 512M x 16 1.35V(1.283-1.45V) 933MHz DDR3-1866bps/pin Commercial (Extended) (0 95 C) 96-ball FBGA | BGA | MT41K512M16HA-107:A |
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AS7C164A-15PCNTR
Alliance Memory
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1 | SRAM SRAM, 64K, 8k x 8, 5v, 28pin Skinny P-DIP, 15ns, Commercial Temp - Tape & Reel | Other | AS7C164A-15PCNTR |
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ASFC128G32T5-51BIN
Alliance Memory
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1 | eMMC eMMC 128GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-TrayFully compliant with JEDEC e·MMC 5.1 Standard (JESD84-B51)• 153-ball BGA, 0.5mm pitch, 11.5 x 13mm, RoHS compliant• 3D TLC NAND base technology• Multiple 3D TLC or enhanced/reliable mode partitions user configurable according to e·MMC Spec 5.1• High performance e·MMC 5.1 specificationo Eleven-wire bus (clock, Data Strobe, 1 bit command, 8 bit data bus) and a hardware reseto Three different data bus width modes: 1 | BGA | ASFC128G32T5-51BIN |
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AS29CF160B-55TIN
Alliance Memory
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1 | M X 8 Bit / 1M X 16 Bit CMOS 5.0 Volt-only | Small Outline Packages | AS29CF160B-55TIN |
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