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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1-969973-0
TE Connectivity
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1 | PCB Mount Receptacle, Vertical, Board-to-Board, 20 Position, 2.54 mm [.1 in] Centerline, Gold, Surface Mount, Signal, Black, AMPMODU HV-100/HV-190 | Other | 1-969973-0 |
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1969795-1
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Housing Features: Housing C | Header, Shrouded - Straight PTH Box | 1969795-1 |
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1969815-1
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope | Other | 1969815-1 |
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1969694-3
TE Connectivity
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0 | Body Features: Connector & Keying Code A | Configuration Features: Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Loaded Positions 3 | Contact Features: Contact Layout Inline | Contact Retention Within Housing With | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Type Pin | Contact Current Rating (Max) 18.5 AMP | Electrical Characteristics: | Other | 1969694-3 |
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1969806-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 12 AMP | Contact Type Socket | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Electrical Characteristics: | Other | 1969806-1 |
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1969798-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Housing Features: Centerline (Pitc | Other | 1969798-1 |
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1969796-1
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Housing Features: Centerline (P | Other | 1969796-1 |
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1969813-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 6 | Number of Power Positions 6 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Type Socket | Contact Current Rating (Max) 12 AMP | Electrical Characteristics: | Other | 1969813-1 |
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1969797-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Socket | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Housing Features: Centerline | Other | 1969797-1 |
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1969805-1
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: | Other | 1969805-1 |
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1969799-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Housing Features: Housing Colo | Other | 1969799-1 |
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1969830-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 6 | Number of Rows 1 | Number of Power Positions 6 | Contact Features: Contact Type Socket | Contact Current Rating (Max) 19 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Electrical Characteristics: | Other | 1969830-1 |
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1969808-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope | Other | 1969808-1 |
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1969803-1
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Housin | Other | 1969803-1 |
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1969694-4
TE Connectivity
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0 | Body Features: Connector & Keying Code A | Configuration Features: Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Loaded Positions 4 | Contact Features: Contact Retention Within Housing With | Contact Current Rating (Max) 17.5 AMP | Contact Layout Inline | Contact Base Material Copper Alloy | Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Electrical Characteristics: | Other | 1969694-4 |
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231-969/001-000
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; angled; Pin spacing 7.62 mm; 9-pole | Other | 231-969/001-000 |
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MAL219691116E3
Vishay
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1 | Supercapacitors / Ultracapacitors 4F 8.4V 7.0x15 3pin Horizontal | Other | MAL219691116E3 |
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MAL219690111E3
Vishay
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1 | Supercapacitors / Ultracapacitors 90F 4.2V 35X25X10 Hybrid Energy Storage Capacitors 196 HVC ENYCAP | Other | MAL219690111E3 |
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MAL219691226E3
Vishay
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1 | Supercapacitors / Ultracapacitors 15F 8.4V 12x15 2pin Horizontal | Other | MAL219691226E3 |
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2-1969543-0
TE Connectivity
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1 | TE Connectivity EP Series, Series Number 2-1969543, 2.5mm Pitch 20 Way 2 Row Straight PCB Header, Solder Termination | Other | 2-1969543-0 |
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MAL219691202E3
Vishay
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1 | Cap Supercap 15F 2.8V -20% to 80% (12 X 5mm) Radial Stacked Coin 12.5mm 120uA 5 Ohm 1000h 85°C | Other | MAL219691202E3 |
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MAL219691201E3
Vishay
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1 | Supercapacitors / Ultracapacitors 15F 1.4V 12x2.5 2pin Vertical | Other | MAL219691201E3 |
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1969352-2
TE Connectivity
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1 | Headers & Wire Housings ASSY DIN R/A RAST5 HDR 02-A, G | Other | 1969352-2 |
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MAL219691225E3
Vishay
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1 | 15 F (EDLC) Supercapacitor 7 V Coin, Stacked Horizontal 3Ohm @ 1kHz 1000 Hrs @ 85°C | Other | MAL219691225E3 |
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MAL219691105E3
Vishay
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1 | 4 F (EDLC) Supercapacitor 7 V Coin, Stacked Vertical 12.5Ohm @ 1kHz 1000 Hrs @ 70°C | Other | MAL219691105E3 |
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