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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1-969973-0
TE Connectivity
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1 | MODU SMT receptacle double row,10W | Other | 1-969973-0 |
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1-969973-2
TE Connectivity
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1 | Headers & Wire Housings 2X12P RECPT HV101 SMT | Other | 1-969973-2 |
3
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1969806-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 12 AMP | Contact Type Socket | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Electrical Characteristics: | Other | 1969806-1 |
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1969798-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Housing Features: Centerline (Pitc | Other | 1969798-1 |
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1969796-1
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Housing Features: Centerline (P | Other | 1969796-1 |
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1969795-1
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Housing Features: Housing C | Header, Shrouded - Straight PTH Box | 1969795-1 |
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1969815-1
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope | Other | 1969815-1 |
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1969830-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 6 | Number of Rows 1 | Number of Power Positions 6 | Contact Features: Contact Type Socket | Contact Current Rating (Max) 19 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Electrical Characteristics: | Other | 1969830-1 |
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1969694-3
TE Connectivity
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1 | Body Features: Connector & Keying Code A | Configuration Features: Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Loaded Positions 3 | Contact Features: Contact Layout Inline | Contact Retention Within Housing With | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Type Pin | Contact Current Rating (Max) 18.5 AMP | Electrical Characteristics: | Other | 1969694-3 |
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1969808-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope | Other | 1969808-1 |
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1969813-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 6 | Number of Power Positions 6 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Type Socket | Contact Current Rating (Max) 12 AMP | Electrical Characteristics: | Other | 1969813-1 |
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1969797-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Socket | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Housing Features: Centerline | Other | 1969797-1 |
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1969805-1
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: | Other | 1969805-1 |
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1969799-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Housing Features: Housing Colo | Other | 1969799-1 |
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1969803-1
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Housin | Other | 1969803-1 |
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1969694-4
TE Connectivity
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1 | Body Features: Connector & Keying Code A | Configuration Features: Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Loaded Positions 4 | Contact Features: Contact Retention Within Housing With | Contact Current Rating (Max) 17.5 AMP | Contact Layout Inline | Contact Base Material Copper Alloy | Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Electrical Characteristics: | Other | 1969694-4 |
3
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MAL219691202E3
Vishay
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1 | Cap Supercap 15F 2.8V -20% to 80% (12 X 5mm) Radial Stacked Coin 12.5mm 120uA 5 Ohm 1000h 85°C | Other | MAL219691202E3 |
3
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MAL219691201E3
Vishay
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1 | Supercapacitors / Ultracapacitors 15F 1.4V 12x2.5 2pin Vertical | Other | MAL219691201E3 |
3
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1969352-2
TE Connectivity
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1 | Headers & Wire Housings ASSY DIN R/A RAST5 HDR 02-A, G | Other | 1969352-2 |
3
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1-1969570-0
TE Connectivity
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1 | ASSY,HDR,VERT,GWT,BOSSED,DUAL ROW, EP2.5 | Other | 1-1969570-0 |
3
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MAL219690102E3
Vishay
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1 | Vishay 90F Supercapacitor EDLC -20 → +80% Tolerance 196 HVC Series 5.6V dc Through Hole | Other | MAL219690102E3 |
3
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MAL219691113E3
Vishay
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1 | VISHAY - MAL219691113E3 - Supercapacitor, ENYCAP™, 4 F, 4.2 V, Radial Leaded, 196 HVC ENYCAP Series, +80%, -20%, 7.5 mm | Other | MAL219691113E3 |
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MAL219691102E3
Vishay
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1 | Supercapacitors / Ultracapacitors 4F 2.8V 7.0x5.0 2pin Vertical | Other | MAL219691102E3 |
3
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ESQ-119-69-L-T
SAMTEC
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1 | 57 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-119-69-L-T |
2
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1969768
Phoenix Contact
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1 | PCB header, nominal cross section: 16 mm?, color: green, nominal current: 76 A, rated voltage (III/2): 1000 V, contact surface: Silver, type of contact: Female connector, Number of potentials: 9, Number of rows: 1, Number of positions per row: 9, number of connections: 9, product range: IPCV 16/..-G, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4 mm, Stecksystem: POWER COMBICON 16, Locking: without, type of packaging: packed in cardboard | Other | 1969768 |
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