20074 Model Download Search Results
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20074
HELUKABEL
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1 | Wire And Cable, 40 Conductor(s), 22AWG, 500V, Flexible Cord And Fixture Wire, | 20074 |
0
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2007435-3
TE Connectivity
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1 | HDMI Connectors, Receptacle, Standard Profile, 1 Port, Top, Perpendicular Right Angle, Through Hole - Solder, Cable-to-Board, 19 Position | Other | 2007435-3 |
3
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2007435-2
TE Connectivity
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1 | HDMI Connectors, Receptacle, Standard Profile, 1 Port, Top, Perpendicular Right Angle, Through Hole - Solder, Cable-to-Board, 19 Position | Other | 2007435-2 |
3
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2007464-1
TE Connectivity
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1 | Body Features: Heat Sink Height Class Networking Short | Heat Sink Height 4.2 MM | Heat Sink Style Pin | Heat Sink Height .165 INCH | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP | Other | 2007464-1 |
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2007435-7
TE Connectivity
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1 | Std HDMI, Flag, T/H | Other | 2007435-7 |
3
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2007435-4
TE Connectivity
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1 | HDMI Connectors, Receptacle, Standard Profile, 1 Port, Top, Perpendicular Right Angle, Through Hole - Solder, Cable-to-Board, 19 Position | Other | 2007435-4 |
3
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2007492-8
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 40 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Cage Material Nickel Silver | Cent | Other | 2007492-8 |
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2007464-2
TE Connectivity
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1 | Body Features: Heat Sink Style Pin | Heat Sink Height Class Networking Tall | Heat Sink Height 6.5 MM | Heat Sink Height .256 INCH | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ | Circuit Application Signal | Other | 2007464-2 |
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2007435-1
TE Connectivity
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1 | Body Features: Shell Plating Finish Matte | Shell Plating Material Tin | Connector Profile Standard | Configuration Features: Number of Ports 1 | PCB Mount Orientation Perpendicular Right Angle | Number of Positions 19 | Stacked No | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Dimensions: PCB Thickness (Min) 1.6 MM | PCB Thickness (Min) . | Other | 2007435-1 |
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1-2007492-5
TE Connectivity
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1 | TE CONNECTIVITY - 1-2007492-5 - CONNECTOR, SFP+, RECEPTACLE, 40 POSITION, PRESS FIT | Other | 1-2007492-5 |
3
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MAX20074ATBD/V+
Analog Devices
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1 | Single 2A/3A 2.2MHz Low-Voltage Step-Down DC-DC Converters | Small Outline No-lead | MAX20074ATBD/V+ |
3
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MF254VS-12-20-0743
XFCN
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1 | 2.54mm 2.54mm 3A -40~ 105 60V Brick nogging 2x10P 3mm Top 20 Circular Holes SMD,P=2.54mm Female Headers ROHS | Other | MF254VS-12-20-0743 |
3
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NCV20074DR2G
onsemi
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1 | Operational Amplifiers - Op Amps R2R QUAD AMPLIFIER | Small Outline Packages | NCV20074DR2G |
3
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NCS20074DTBR2G
onsemi
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1 | Operational Amplifiers - Op Amps R2R QUAD AMPLIFIER | Small Outline Packages | NCS20074DTBR2G |
3
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01020074Z
LITTELFUSE
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1 | Fuse Clip; Snap Mount; 15 A (Max.) Littelfuse 102 Spring Brass PCB Mount Fuse Clip for 1/4in Cartridge Fuse | Other | 01020074Z |
3
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NCS20074DR2G
onsemi
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1 | Operational Amplifiers - Op Amps R2R QUAD AMPLIFIER | Small Outline Packages | NCS20074DR2G |
3
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MAX20074ATBA/V+
Analog Devices
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1 | Switching Voltage Regulators 3A 2.2MHz Low Voltage Step-Down DC-DC Converter | Small Outline No-lead | MAX20074ATBA/V+ |
3
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NCV20074DTBR2G
onsemi
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1 | Operational Amplifiers - Op Amps R2R QUAD AMPLIFIER | Small Outline Packages | NCV20074DTBR2G |
3
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3.14.200.741/0000
RAFI
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1 | Tactile Switch SPST-NO Top Actuated Through Hole | Other | 3.14.200.741/0000 |
3
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MAX20074ATBD/V+T
Analog Devices
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1 | Single 2A/3A 2.2MHz Low-Voltage Step-Down DC-DC Converters | Small Outline No-lead | MAX20074ATBD/V+T |
3
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MAX20074ATBA/V+T
Analog Devices
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1 | Single 2A/3A 2.2MHz Low-Voltage Step-Down DC-DC Converters | Small Outline No-lead | MAX20074ATBA/V+T |
3
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2007492-5
TE Connectivity
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1 | (2007492-5) SFP+assy 2x1 Spring Fingers 4LP Sn | 2007492-5 |
0
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2007435-1
TE Connectivity
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1 | (2007435-1) Flag_HDMI CONNECTOR | 2007435-1 |
0
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2007464-9
TE Connectivity
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1 | Connector Accessory | 2007464-9 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2007417-7
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Positions 80 | Number of Ports 4 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .032 INCH | Cage Ma | 2007417-7 |
1
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