Showing 25 of 116445 results
| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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GBU4J
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1 | Ideal for Printed Circuit Bboard; Glass-Passivated Junction; UL certified, UL #E258596; Reliable Low-Cost Construction Utilizing Molded Plastic Technique; Surge Overload Rating: 150 A peak | Other | GBU4J |
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NC7SP157P6X
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1 | 0.9V to 3.6V VCC supply operation; Ultra low dynamic power; Static Drive (IOH/IOL)±2.6 mA @ 3.00V VCC±2.1 mA @ 2.30V VCC±1.5 mA @ 1.65V VCC±1.0 mA @ 1.40V VCC±0.5 mA @ 1.10V VCC±20 µA @ 0.9V VCC; Power-Off high impedance inputs and outputs; Ultra small MicroPak™ leadfree package; 3.6V overvoltage tolerant I/O's at VCC from 0.9V to 3.6V; tPD 3.0 ns typ for 3.0V to 3.6V VCC4.0 ns typ for 2.3V to 2.7V VCC5.0 ns typ for 1.65V to 1.95V VCC7.0 ns typ for 1.40V to 1.60V VCC11.0 ns typ for 1.10V to 1.30V VCC30.0 ns | Small Outline Packages | NC7SP157P6X |
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MC74VHC125DTR2G
onsemi
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1 | Latchup Performance Exceeds 300mA; Power Down Protection Provided on Inputs; High Speed: tPD = 3.8ns (Typ) at VCC = 5V; Designed for 2V to 5.5V Operating Range; ESD Performance: HBM > 2000V; Machine Model > 200V; Low Noise: VOLP = 0.8V (Max); Low Power Dissipation: ICC = 4mA (Max) at TA = 25°C; Pin and Function Compatible with Other Standard Logic Families; Balanced Propagation Delays; Chip Complexity: 72 FETs or 18 Equivalent Gates; High Noise Immunity: VNIH = VNIL = 28% VCC; These devices are available in | Small Outline Packages | MC74VHC125DTR2G |
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NCP361SNT1G
onsemi
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1 | Very Fast Protection, Up to 20 V, with 25 µA Current Consumption; On-chip PMOS Transistor; Overvoltage Lockout (OVLO); Undervoltage Lockout (UVLO); Overcurrent Protection.; Alert FLAG Output; EN Enable Pin; Thermal Shutdown; 6-Lead UDFN 2 x 2 mm Package; TSOP-5 3 x 3 mm Package; These are Pb-Free Devices | SOT23 (5-Pin) | NCP361SNT1G |
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NCP1075AAP065G
onsemi
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1 | Current-Mode Fixed Frequency Operation (65 & 100 kHz) - 130 kHz for B version only; Peak Current: NCP1075A/B = 400 mA; 2nd Level Current Protection; Over Power Protection; Adjustable Brown-out Protection and OVP; Frequency Jittering (including during frequency foldback mode); 300 µA No Load Power Consumption; Frequency Foldback Operation; Auto-Recovery Output Short Circuit Protection with Timer-Based Detection; Dynamic Self-Supply (DSS); Skip-Cycle Operation at Low Peak Current; Integrated 700 V MOSFET with | Other | NCP1075AAP065G |
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MMUN2238LT1G
onsemi
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1 | Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant | SOT23 (3-Pin) | MMUN2238LT1G |
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1SMA5923BT3G
onsemi
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1 | Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con | Diodes Moulded | 1SMA5923BT3G |
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NTR4003NT3G
onsemi
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1 | Low Gate Voltage Threshold (VGS(TH)) to Facilitate Drive Circuit Design; Low Gate Charge for Fast Switching; ESD Protected Gate; SOT-23 Package Provides Excellent Thermal Performance; Minimum Breakdown Voltage Rating of 30 V; RoHS Compliant | SOT23 (3-Pin) | NTR4003NT3G |
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MC74HC174ADR2G
onsemi
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1 | Chip Complexity: 162 FETs or 40.5 Equivalent Gates; Outputs Directly Interface to CMOS, NMOS, and TTL; Output Drive Capability: 10 LSTTL Loads; Low Input Current: 1.0 mA; In Compliance with the Requirements Defined by JEDEC Standard No. 7A; Operating Voltage Range: 2 to 6 V; Pb-Free Packages are Available* | Small Outline Packages | MC74HC174ADR2G |
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MMSZ4698T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | MMSZ4698T1G |
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NB6N11SMNG
onsemi
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1 | Maximum Input Clock Frequency > 2.0 GHz; Maximum Input Data Rate > 2.5 Gb/s; 1 ps Maximum of RMS Clock Jitter; Typically 10 ps of Data Dependent Jitter; 380 ps Typical Propagation Delay; 120 ps Typical Rise and Fall Times; These devices are available in Pb-free package(s). Specifications herein | Quad Flat No-Lead | NB6N11SMNG |
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MMBZ27VCWT3G
onsemi
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1 | SC70 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration; Standard Zener Breakdown Voltage Range 27 V; Peak Power 40 W @ 1.0 ms (Unidirectional); ESD Rating Class 3B (>16 kV) per the Human Body Model; ESD Rating Class C (>400 V) per the Machine Model; Low Leakage < 5.0 uA; Flammability Rating UL 94 V0; This is a PbFree Device | SOT23 (3-Pin) | MMBZ27VCWT3G |
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LM317MBDTRKG
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1 | Linear Voltage Regulator IC Positive Adjustable 1 Output 500mA DPAK | Other | LM317MBDTRKG |
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HCPL2531V
onsemi
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1 | Obsolete - 8-Pin DIP 1Mbit/s Dual-Channel High Speed Transistor Output Optocoupler (Not recommend for new design. The new equivalent part number is HCPL253xM) | Dual-In-Line Packages | HCPL2531V |
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FDY102PZ
onsemi
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1 | HBM ESD protection level = 1400 V (Note 3) ; Max rDS(on) = 0.7 Ω at VGS = –2.5 V, ID = –0.70 A; Max rDS(on) = 0.5 Ω at VGS = –4.5 V, ID = –0.83 A; RoHS Compliant; Max rDS(on) = 1.2 Ω at VGS = –1.8 V, ID = –0.43 A; Max rDS(on) = 1.8 Ω at VGS = –1.5 V, ID = –0.36 A | SO Transistor Flat Lead | FDY102PZ |
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FAM65CR51DZ2
onsemi
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1 | Power Driver Module MOSFET 2 Independent 650 V 33 A 12-SSIP Exposed Pad, Formed Leads | Other | FAM65CR51DZ2 |
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2N7002L
onsemi
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1 | RoHS Compliant | SOT23 (3-Pin) | 2N7002L |
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FFSB0865B-F085
onsemi
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1 | Max Junction Temperature 175 oC; Avalanche Rated 33 mJ; High Surge Current Capacity; Positive Temperature Coefficient; Ease of Paralleling; No Reverse Recovery / No Forward Recovery; AEC-Q101 Qualified | Other | FFSB0865B-F085 |
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MC100LVEL51DTR2G
onsemi
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1 | Flip Flop 1 Element D-Type 1 Bit Positive, Negative 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | Small Outline Packages | MC100LVEL51DTR2G |
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MURS205T3G
onsemi
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1 | Obsolete - Power Rectifier, Ultra-Fast Recovery, 2 A, 100 V | Diodes Moulded | MURS205T3G |
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AMIS30660CANH2RG
onsemi
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1 | Fully compatible with the ISO 11898-2 standard; Certified Authentication on CAN Transceiver Conformance (d1.1); High speed (up to 1Mbit/s); Ideally suited for 12V and 24V industrial and automotive applications; Low EME common-mode choke is no longer required; Differential receiver with wide common-mode range (+/- 35V) for high EMS; No disturbance of the bus lines with an un-powered node; Transmit data (TxD) dominant time-out function; Thermal protection; Bus pins protected against transients in an automotiv | Small Outline Packages | AMIS30660CANH2RG |
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UJ3D1220KSD
onsemi
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1 | 100% UIS tested; Operating temperature: 175?C (max); Easy paralleling; Extremely fast switching not dependent on temperature; No reverse or forward recovery; Enhanced surge current capability, MPS structure; Excellent thermal performance, Ag sintered | Transistor Outline, Vertical | UJ3D1220KSD |
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UJ3D1220K2
onsemi
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1 | Operating temperature: 175?C (max); Easy paralleling; Extremely fast switching not dependent on temperature; No reverse or forward recovery; Enhanced surge current capability, MPS structure; Excellent thermal performance, Ag sintered; 100% UIS tested | Transistor Outline, Vertical | UJ3D1220K2 |
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MMBT2484LT3G
onsemi
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1 | Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Miniature SOT-23 Surface Mount Package Saves Board Space; Pb-Free Package is Available | SOT23 (3-Pin) | MMBT2484LT3G |
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SZMMBZ5226BLT1G
onsemi
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1 | 225 mW Rating on FR-4 or FR-5 Board; Zener Voltage Range - 2.4 V to 91 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING: | SOT23 (3-Pin) | SZMMBZ5226BLT1G |
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